Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA)

Published by	Publication Date	Number of Pages
JEDEC	01/01/2013	18

Category: JEDEC

Description

JEDEC JEP170 – Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA)

This publication provides description of defects observed in FCxGA components that can adversely impact end-user products and/or applications. It will also provide illustration on other defects that may be considered visual nonconformities since they should be less disruptive of quality or reliability to customer products. Finally, it will depict a method for visual inspection that can be utilized to identify these defects or visual nonconformities and guidance for disposition. Official criteria for product acceptance should be in actual product drawings and specifications.