TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES

Published by	Publication Date	Number of Pages
JEDEC	10/01/2016	46

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Category: JEDEC

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JEDEC JESD217.01 – TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES

As ball grid array component pitch continues to decrease, the need to characterize solder voidinghas become more significant. Solder void manifestation (type and/or sizes) has been used todetermine process capability as a means of quality assurance during process transfer, and asindicators of process stability from in-line manufacturing monitors. This document describeshow to characterize voids in solder spheres in ball grid array packages prior to surface-mount(SMT) reflow soldering.