EXTENSION OF THERMAL TEST BOARD STANDARDS FOR PACKAGES WITH DIRECT THERMAL ATTACHMENT MECHANISMS

Published by	Publication Date	Number of Pages
JEDEC	02/01/1999	8

Category: JEDEC

Description

JEDEC JESD51-5 – EXTENSION OF THERMAL TEST BOARD STANDARDS FOR PACKAGES WITH DIRECT THERMAL ATTACHMENT MECHANISMS

This extension of the thermal standards provides a standard fixture for direct attach type packages such as deep-downset of thermally tabbed packages. This specification provides additional design detail for use in developing thermal test boards with application to these package types. This document is in addition to and not replacement for the design specifications in other standards.