IPC 4555 – Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
This performance specification sets requirements for High Temperature Organic Solderability Preservatives (OSP-High Temperature) for Pb-free soldering. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM).
Product Details
Published:
04/01/2022
ISBN(s):
9781638160748
Number of Pages:
24
File Size:
1 file , 990 KB
Product Code(s):
4555-STD-0-D-0-EN-0, 4555-STD-0-D-0-EN-0
Note:
This product is unavailable in Russia, Ukraine, Belarus
