Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)

Published by	Publication Date	Number of Pages
IPC	02/28/2017	52

Category: IPC

Description

IPC 7530A – Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)

IPC 7530A provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies. This revision expands the focus of the original standard from reflow profiling to include profiling for vapor phase, laser, selective soldering and wave soldering. The revision also includes a full-color troubleshooting guide for addressing common defects which can be attributed to profiling.