IPC 9702-WAM1 – Monotonic Bend Characterization of Board-Level Interconnects with Amendment 1
This publication is intended to characterize the frature strength of a component’s board level-interconnect by providing a common method of establishing the fracture resistance to flexural loading that may occur during conventional non-cyclic board assembly and test operations. The document is applicable to surface mount components attached to printed wiring boards using conventional solder reflow technologies and supplements existing standards that address mechanical shock or impact during shipping, handling or field operation. Includes the amendment to Section 8.7-Test Board Daisy-Chain Links.
Product Details
Published:
05/01/2015
ISBN(s):
9781611931914
Number of Pages:
28
File Size:
1 file , 610 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus
