IPC J-STD-020A PDF

Description

The purpose of this standard is to identify the classification level of non-hermetic solid state surface mount devices that are sensitive to moisture-induced stress. They can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during the assembly solder reflow attachment and/or repair operation. This standard is used to determine what classification level should be used for initial reliability qualification.

Product Details

Published:

04/01/1999

Number of Pages:

20

Part of:

IPC M109

Note:

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