Mechanical standardization of semiconductor devices – Part 4: Coding system and classification into forms of package outlines for semiconductor device packages CONSOLIDATED EDITION

Published by	Publication Date	Number of Pages
IEC	10/22/2002	43

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Category: IEC

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IEC 60191-4 Ed. 2.2 b – Mechanical standardization of semiconductor devices – Part 4: Coding system and classification into forms of package outlines for semiconductor device packages CONSOLIDATED EDITION

Describes a method for the designation and the classification into forms of package outlines for semiconductor devices. Provides a systematic method for generating universal descriptive designators for semiconductor packages.