Mechanical standardization of semiconductor devices – Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages – Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Published by	Publication Date	Number of Pages
IEC	12/11/2001	10

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Category: IEC

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IEC 60191-6-2 Ed. 1.0 en – Mechanical standardization of semiconductor devices – Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages – Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball and column terminal packages.