Mechanical standardization of semiconductor devices – Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for glass sealed ceramic quad flatpack (G-QFP)

Published by	Publication Date	Number of Pages
IEC	08/27/2001	22

Category: IEC

Description

IEC 60191-6-8 Ed. 1.0 b – Mechanical standardization of semiconductor devices – Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for glass sealed ceramic quad flatpack (G-QFP)

IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.