Semiconductor devices – Mechanical and climatic test methods – Part 25: Temperature cycling

Published by	Publication Date	Number of Pages
IEC	07/11/2003	25

Preview

Category: IEC

Description

IEC 60749-25 Ed. 1.0 b – Semiconductor devices – Mechanical and climatic test methods – Part 25: Temperature cycling

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.