Semiconductor devices – Mechanical and climatic test methods – Part 37: Board level drop test method using an accelerometer

Published by	Publication Date	Number of Pages
IEC	01/30/2008	39

Preview

Category: IEC

Description

IEC 60749-37 Ed. 1.0 b – Semiconductor devices – Mechanical and climatic test methods – Part 37: Board level drop test method using an accelerometer

Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.