Semiconductor devices – Mechanical and climatic test methods – Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

Published by	Publication Date	Number of Pages
IEC	11/01/2021	30

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Category: IEC

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IEC 60749-39 Ed. 2.0 b – Semiconductor devices – Mechanical and climatic test methods – Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

This part of IEC 60749 details the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components.

These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow.