IEC 60749-8 Ed. 1.0 b PDF

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Semiconductor devices – Mechanical and climatic test methods – Part 8: Sealing

Published by Publication Date Number of Pages
IEC 08/30/2002 31
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Description

IEC 60749-8 Ed. 1.0 b – Semiconductor devices – Mechanical and climatic test methods – Part 8: Sealing

Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices.

Product Details

Edition:
1.0
Published:
08/30/2002
Number of Pages:
31
File Size:
1 file , 560 KB
Note:
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