IEC 61190-1-3 Ed. 2.0 en:2007 PDF

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Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
standard by International Electrotechnical Commission, 04/26/2007

Category: IEC

Description

Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for “special” electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. It is a quality control document and is not intended to relate directly to the material’s performance in the manufacturing process. Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes, ingots, preforms, bars with hook and eye ends, multiple-alloy solder powders, etc. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an amendment to Table B.1 concerning lead-free solder alloys.