Semiconductor devices – Micro-electromechanical devices – Part 10: Micro-pillar compression test for MEMS materials

Published by	Publication Date	Number of Pages
IEC	07/26/2011	22

Category: IEC

Description

IEC 62047-10 Ed. 1.0 b – Semiconductor devices – Micro-electromechanical devices – Part 10: Micro-pillar compression test for MEMS materials

IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. This standard is applicable to metallic, ceramic, and polymeric materials.