Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-2: Shear strength test

Published by	Publication Date	Number of Pages
IEC	05/14/2008	33

Category: IEC

Description

IEC 62137-1-2 Ed. 1.0 b – Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-2: Shear strength test

The test method described in IEC 62137-1-2:2007 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.