Device embedding assembly technology – Part 1: Generic specification for device embedded substrates

Published by	Publication Date	Number of Pages
IEC	10/01/2019	24

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Category: IEC

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IEC 62878-1 Ed. 1.0 en – Device embedding assembly technology – Part 1: Generic specification for device embedded substrates

This part of IEC 62878 specifies the generic requirements and test methods for device embedded
substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.

This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.

The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.