BS 3934-5 PDF

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Mechanical standardization of semiconductor devices. Recommendations applying to tape automated bonding (TAB) of integrated circuits

Published by Publication Date Number of Pages
BSI 09/15/1997 38
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Description

BS 3934-5 – Mechanical standardization of semiconductor devices. Recommendations applying to tape automated bonding (TAB) of integrated circuits

Applicable to the finished component supplied to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).

Product Details

Published:
09/15/1997
ISBN(s):
0580278123
Number of Pages:
38
File Size:
1 file , 940 KB
Product Code(s):
01094344, 01094344, 01094344
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