BS 5909 – Method for scale adhesion test for oxygen-free copper
Specifies the principle and method for scale adhesion testing for oxygen-free high conductivity copper, primarily for use in electronic devices involving glass to metal seals or other uses requiring an adherent film of copper oxide.
Product Details
Published:
04/30/1980
ISBN(s):
0580112659
Number of Pages:
2
File Size:
1 file , 290 KB
Product Code(s):
00027795, 00027795, 00027795
Note:
This product is unavailable in Ukraine, Russia, Belarus
